Inspects components, housings, and finished assemblies of electromechanical products for conformance to established work instruction, industry standards, drawings, etc., using low / high power microscopes, test equipment, and hand held inspection tools. Will enter inspection results into QMS and MRP systems, and work with engineering to report and detail non conformances.

Evaluate manufacturing processes based on quality criteria Study production and machine requirements Develop and test effective automated and manual systems Design and install equipment Organize and manage manufacturing workflows and resources Optimize facility layouts, production lines, and machine operations Find ways to reduce costs and maximize quality Train staff in

Quality Inspector Location Chelmsford, MA Job ID #68173 Pay Range $28 32 Verified Active Clearance status Candidate hired will not be able to start until a minimum of an interim clearance is obtained, prefer an active clearance from the start.Verified Active Clearance status must be on top of resume Job Overview Inspects components, housings, and finished assemblies of el

Perform a wide variety of tasks within the Finance Function with a primary FOCUS on (FP&A) FINANCIAL PLANNING AN ANALYSIS and GENERAL FINANCE SUPPORT for an IT Physical Security Solutions Unit within it's Parent Company. RESPONSIBILITIES The Financial Analysts will provide thorough Financial Analysis of sales, price, margin, productivity, and cash flow. Prepare , distribu

Assembler 2nd Shift Location Chelmsford, MA Job ID #69123 Pay Range $30 37 Performs fabrication or modification tasks on RF microwave hybrid modules and sub assemblies of mid range to high complexity. Duties include installation of connectors, substrates, components and modules in highly complex microwave assemblies, often utilizing using paste and sheet epoxies. Performs

Assembler Location Chelmsford, MA Job ID #69124 Pay Range $30 37 Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub assemblies. Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microele